Power chips are connected to external circuits through packaging, and their efficiency relies on the assistance of the packaging. In high-power circumstances, power chips are typically packaged as power modules. Chip affiliation describes the electrical link on the top surface area of the chip, which is normally light weight aluminum bonding cord in standard components. ^
Typical power component package cross-section
Currently, industrial silicon carbide power modules still mainly use the packaging innovation of this wire-bonded typical silicon IGBT component. They deal with issues such as big high-frequency parasitic parameters, insufficient warm dissipation ability, low-temperature resistance, and inadequate insulation toughness, which restrict using silicon carbide semiconductors. The display screen of outstanding performance. In order to fix these troubles and totally make use of the big prospective benefits of silicon carbide chips, numerous brand-new product packaging technologies and options for silicon carbide power components have actually emerged over the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually established from gold cord bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually created from gold cables to copper cables, and the driving pressure is cost decrease; high-power tools have actually established from aluminum wires (strips) to Cu Clips, and the driving pressure is to improve item efficiency. The better the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a solid copper bridge soldered to solder to attach chips and pins. Compared to conventional bonding product packaging approaches, Cu Clip technology has the complying with advantages:
1. The link between the chip and the pins is made of copper sheets, which, to a specific degree, replaces the basic wire bonding approach in between the chip and the pins. Therefore, a special plan resistance value, greater existing circulation, and better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can completely conserve the cost of silver plating and inadequate silver plating.
3. The product look is completely consistent with normal products and is mainly utilized in servers, portable computers, batteries/drives, graphics cards, electric motors, power products, and other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding technique is extra expensive and complicated, but it can accomplish far better Rdson and far better thermal results.
( copper strip)
Copper sheet plus cord bonding approach
The resource pad makes use of a Clip approach, and eviction uses a Cord technique. This bonding technique is somewhat cheaper than the all-copper bonding method, conserving wafer area (suitable to extremely small entrance areas). The procedure is easier than the all-copper bonding method and can acquire better Rdson and better thermal effect.
Distributor of Copper Strip
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